BH15 2UUL MagGrid Pad Chip Silicone Buffer Soldering Pad. This pad is designed for BGA (Ball Grid Array) hard disk, CPU, and IC repair, particularly in mobile phone and other electronics repair. Material and Design: It's made of soft, high-temperature resistant silicone with strong magnetic adsorption, designed to securely hold BGA stencils and chips during tin planting. Functionality: The pad prevents BGA stencils from shifting during tin planting, ensuring a more stable and firm chip placement. Heat Dissipation: It features a hollow heat dissipation hole design on the back for efficient cooling during soldering processes, preventing bulging of the steel net during tin planting. Durability: The silicone material is elastic and can withstand high temperatures, up to 500℃.