Discount: 17%
DA61 2UUL 4in1 Hand Finish S.E.X.Y II Blade Set For PCB Underfill Clean and Removing Glue. It is designed for cleaning underfill and removing glue from mobile phone motherboards and ICs. The set includes a handle and multiple interchangeable blades for various tasks. Model S is used for prying CPU IC hard disks, and Model E is for removing glue from ICs. Model X is a professional edge glue removal tool, and Model Y is for cutting black glue without damaging the board.
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