EMMC FMT Steel BGA Reballing Stencil, For EMMC/EMCP/UFS/UMCP/LPDDR/NAND/PCI
PKR 650
Availability:
In Stock
EMMC FMT Steel BGA Reballing Stencil, For EMMC/EMCP/UFS/UMCP/LPDDR/NAND/PCI Specifically Designed For Mobile Phone Repair and Reballing Of Various Chipsets.