بِسْمِ ٱللَّٰهِ ٱلرَّحْمَٰنِ ٱلرَّحِيمِ
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EMMC FMT Steel BGA Reballing Stencil, For EMMC/EMCP/UFS/UMCP/LPDDR/NAND/PCI Specifically Designed For Mobile Phone Repair and Reballing Of Various Chipsets.
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السَّلَامُ عَلَيْكُمْ وَرَحْمَةُ اللهِ وَبَرَكَاتُهُ
Important Instructions:
