Discount: 28%
EXY:1 FMT EXYNOS Steel Original BGA Reballing Stencil For Exynos 9610/9611, E850-3830, E9810, 1580-E8855, 1480-E8845, 1280-E8825, 1330-E8535SP 1380-E8835P. Used for repairing and reballing the Ball Grid Array (BGA) packages of the listed chips. Compatible with Exynos 9610/9611, Exynos 850-3830, Exynos 9810, and other specific variants like 1580-E8855 and 1380-E8835P. These are tools for professional mobile phone repair technicians. The product is typically made of steel mesh for direct heating application.
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