Discount: 16%
iTin-12 MECHANIC 1mm & 2mm BGA Reballing Stencil Magnetic Tin Planting Platform. Features: Includes a strong magnetic base to hold stencils securely and a heat-resistant surface for chip-level repair tasks. Application: Designed for precise reballing and tin plating of BGA components, such as CPU, NAND, and IC chips. Package: Comes with a platform and two blades for scraping solder paste.
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