MS1 Mini Mijing Chip Glue Removal Heating Table is a Tool Used For Removing Glue From Mobile Components Like CPU, RAM, and Chips Without Using Hot Air or Soldering irons. It is compact and easy to handle. It offers rapid heating with one-button adjustment for simple operation. It is compatible with CPU/IC heating rework platforms, making it versatile for mobile phone repair. It is designed for precise and safe handling of delicate components. It helps in chip repair and glue removal tasks in electronics. It is suitable for removing glue from mobile phone components like CPU, NAND, eMMC, SSD, and BGA chips. It is a temperature-controlled platform ensuring accuracy and safety. It is free of hot air guns and soldering irons.