QLM:2 FMT Snapdragon Steel Original BGA Reballing Stencil For Snapdragon SM4250, SM6115, SM6125, SM6150, SM6225, SM7150, SM7125,765G, SM7250, SM7225/6375/6350/4375/4350,SM7315/7325,SM7350. Function: Used in the BGA (Ball Grid Array) reballing process to create a uniform pattern of solder balls on components. Compatibility: The stencils are labeled for specific Qualcomm Snapdragon processors, including the 460, 662, 665, 675, 680, 720G, 730G, 750G, 765G, 778G, and 775G. Material: Typically manufactured from durable materials like stainless steel or polyimide film. Purpose: Essential tools for electronics technicians to replace or repair faulty CPU components on a printed circuit board (PCB).