RL-601T RELIFE 26in1 iPhone X-16PM 16E Middle Board Tinning Platform Set.3D BGA Reballing Stencil Repair Kit. Function: It's designed for precise tin planting and BGA reballing on iPhone middle layer motherboards, specifically for models from iPhone X up to the 16 Pro Max and 16E. Features: The set includes a universal base with strong magnetic adsorption for precise positioning and stability during the repair process. It also comes with high-quality steel stencils for accurate tin ball placement. Compatibility: The universal base allows for unlimited compatibility with various iPhone models within the specified range, and new model templates can be added without needing a new base. Benefits: It aims to enhance accuracy in reballing, reduce the risk of damage during motherboard repair, and provide a user-friendly experience for technicians and DIY enthusiasts.