XG50 MECHANIC 183C 35g BGA Reballing Solder Paste, For Mobile Phone Repair and Electronics BGA Reballing Paste. Model/Type: XG-50 Alloy Composition:(Sn63Pb37) (63% Tin, 37% Lead) Melting Point: 183°C (361°F) Weight: 35 grams Features: Ideal for BGA welding, smartphone motherboard repairs, and SMD components.
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