YCS iPhone X-15 CPU NAND Wi-Fi NFC BGA Reballing Stencil. This stencil, manufactured by YCS (YCS 酥长顺), is part of the IPX-15 kit and is used for reballing (replacing solder balls) on chips related to Wi-Fi, baseband, and NAND memory. It is compatible with a range of iPhone models, as indicated by the markings on the stencil, which include XS, 11, 7/8/X/XR, 12/13/14, and 15 for Wi-Fi, and specific chips like A11, A12, A13, A14, A15, A16, A17, and various NAND sizes. The stencil also caters to baseband repairs for models 8-X, 11, 12, 13, and 14/15, as well as NFC repairs for several iPhone versions.
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