YCS Universal BGA Reballing Stencil. It's a tool used in electronics repair, specifically for reballing BGA (Ball Grid Array) integrated circuits. Reballing is the process of replacing the solder balls on a BGA chip. Purpose: Helps to accurately place solder balls on BGA chips during the reballing process. Material: Typically made of metal, often stainless steel. Hole Sizes: Features various hole sizes (e.g., 0.3, 0.35, 0.4, 0.5, 0.6, 0.8 mm) to accommodate different BGA chip sizes. Hole Types: Includes parallel, offset, and 45° angled holes for versatile use. Usage: Solder paste or solder balls are applied to the stencil, then heated to create new solder balls on the BGA chip.