T4 Pro JTX Universal Chip Glue Removal/Reballing Platform For iPhone /Android CPU EMMC RAM 84 Model Of Chips With 14 Stencil. Supported models are as follows: Qualcomm: MSM8909/8905, MSM8916/8939, MSM8917, MSM8953, MSM8953 1AB, MSM8937/8940, MSM8996, SM8150, SM8250, SM8250-002, SM8350, SM8450, SM8475, SM8550, SM8650, SM6115, SM7225-00AB, SM7250, SM7325, SM7350, SDM439, SDM636, SDM710, SDM845,SM665,SM6150,SM8750,SM730G,SM7150,SM680,SM6225,SM7Gen1,SM6450,SM720,SM7125 Dimensity: MT6761V/6762V/6765V, MT6885Z, MT6895Z, MT6893Z, MT6855V, MT6853V, MT6877V, MT6769V, MT6873V, MT6833V, 1100/1200, 9200, 9300 Android RAM: BGA 376, BGA 436, BGA 496, BGA 556 Samsung Exynos: 990, 8895, 980, 2100, 2200, 9820 Huawei Hisilicon: HI3660, HI9290/L, HI6280, HI3690 5G, HI3680, HI36A0, HI3670, HI36A0, HI6260, HI3690 4G Apple: A8, A9, A10, A11, A12, A13, A14, A15, A16, A17,A18,A18 Pro. Function: Removes glue and plants tin on chips. Compatibility: Supports various chip models from brands like Apple, Samsung, Huawei, and others. Chip Support: Compatible with CPU, EMMC, and RAM chips. Model Variety: Supports 76 to 84 models of chips. Features: Includes magnetic clamping, 3D tin planting net, and precise positioning. Material: Made of high-quality steel for wear resistance and durability.